DTMES 2022

Historical Perspective and Current Trends in High-Speed Serial Interfaces
Eskinder Hailu Wakjira, Intel, USA

Abstract - The presentation starts with an introduction to Serial Input/Output (IO) links in computing devices such as computers, tablets, and smart phones. Common serial-link building blocks on silicon, package, and PCBs are presented. Then an in-depth analysis of these building blocks and their interaction with each other in establishing overall link performance is presented. Various trade-offs dictate the overall link architecture which will be covered. Serial IO design, modelling, and verification methodology will be described. This is followed by review of common serial interface standards and their target applications. The presentation will conclude by presenting historical, current, and future trends and examples of current state-of-the-art designs.

Eskinder Hailu Wakjira is a Principal Engineer/High-Speed I/O Architect at Intel. Between 2013 and 2021 he was a Principal Engineer/Manager at Qualcomm where he was responsible for the development of short-reach, low-power, and low-latency serial IO links for mobile products such as smart-phones and tablets. Prior to Qualcomm he has worked at Apple, True Circuits, and IBM all in the areas of mixed-signal IP development with focus on high-speed clocking and serial IO links. He is co-author on over seventy issued patents in the area of mixed-signal design. He received the B.S. degree in Electrical Engineering and in Economics from Yale University, New Haven, Connecticut, USA in 1998, and the M.S. and Ph.D. degrees in Electrical Engineering with a minor in Applied Physics from Cornell University, Ithaca, New York, USA in 2001 and 2003, respectively.